A3P600-FG256I vs A3P600-FG256 Perbandingan
Perbandingan bersamaan detil A3P600-FG256I dari Microchip Technology dan A3P600-FG256 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
A3P600-FG256I ✓ AktifMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3P600-FG256I | A3P600-FG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | ProASIC3 | — |
| System Gates | 600,000 | 600000 |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) | — |
| Total RAM Bits | 110,592 | — |
| Number of User I/O | 177 | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Maximum Internal Frequency | [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] | — |
| Paket | 256-LBGA (FBGA-256) | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | [DATA_NEEDED: exact industrial temperature range (I suffix)] | — |
| Programming Technology | Nonvolatile Flash | — |
| Reprogrammability | In-system programmable | — |
| I/O Supply Voltage Range | [DATA_NEEDED: exact I/O bank voltage range] | — |
| Status RoHS | unknown | RoHS non-compliant (per Microchip USA listing) |
| REACH Status | unknown | — |
| Status Lingkungan Hidup | active per DigiKey (ships today) | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Suhu Kerja | — | 0 C to 85 C (TJ) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |