ATSAMA5D225C-D1M-CU vs ATSAMA5D22B-CNR Perbandingan

Perbandingan bersamaan detil ATSAMA5D225C-D1M-CU dari Microchip Technology dan ATSAMA5D22B-CNR dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Microchip Technology
ATSAMA5D225C-D1M-CU ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip

ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip

ATSAMA5D225C-D1M-CU ✓ Aktif
Microchip Technology
ATSAMA5D22B-CNR ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum ATSAMA5D225C-D1M-CU ATSAMA5D22B-CNR
Merek Microchip Technology Microchip Technology
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Core Processor ARM Cortex-A5 —
Number of Cores 1 Core, 32-Bit —
Maximum CPU Clock 500 MHz —
Integrated DRAM 128 Mbit DDR2 SDRAM (SiP) —
ROM / Boot Code 160 KB ROM —
Graphics Acceleration Yes (LCD controller up to WXGA 1366x768) —
RAM Controllers LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI —
Ethernet 10/100/1000 GMAC —
USB 1x HSIC, 1x USB 2.0 HS Host/Device —
CAN CAN-FD —
Security Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG —
Touch Controller Peripheral Touch Controller (PTC) integrated —
Audio Embedded audio subsystem (I2S, Class-D amplifier) —
Paket 196-ball TFBGA 11x11 mm, 0.8 mm pitch 196-TFBGA (11x11x1.2 mm)
Suhu Kerja -40C to +85C (Industrial, IND TEMP) -40C to +105C (extended)
Tegangan Pemuat 1.2 V core (per typical SiP) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS Compliant (Green, lead-free) Compliant
Architecture — ARM Cortex-A5 (ARMv7-A)
Core Count — 1
Data Width — 32-bit
Frekuensi Bawah Maximum — 500 MHz
Core Supply Voltage — 1.2 V
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 128 KB (configurable as SRAM)
NEON Media Processing Engine — Yes
Floating Point Unit — Yes
ARM TrustZone — Yes
Peripheral Touch Controller (PTC) — Yes
Embedded Audio Subsystem — Yes (I2S/TDM)
Ball Pitch — 0.8 mm
Packaging — Tape & Reel (T&R)

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