EP1C12F324C7 vs EP1C12F324C8L Perbandingan
Perbandingan bersamaan detil EP1C12F324C7 dari Intel dan EP1C12F324C8L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C12F324C7 | EP1C12F324C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone | Cyclone |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Total RAM Bits | 239,616 | — |
| Number of CLBs / LABs | 1,206 LABs (each with 10 LEs) | — |
| Number of Logic Cells / Gates | 12,060 cells (Cyclone Family) | — |
| User I/Os | 249 | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Core Voltage | 1.5 V | — |
| Operating Frequency (max) | 320.1 MHz | — |
| Number of PLLs | 2 | — |
| Paket | 324-ball FineLine BGA (FBGA-324) | FBGA-324 |
| Package Dimensions | 19 x 19 mm, 1.0 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Suhu Kerja | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Configuration Mode | Passive Serial (PS) / Active Serial (AS) / JTAG | — |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 8 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Level MSL | — | [DATA_NEEDED: MSL level] |