EP1C12F324C7 vs EP1C12F324C8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C12F324C7 disebabkan oleh Intel dan EP1C12F324C8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C12F324C7 | EP1C12F324C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone | Cyclone |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Total RAM Bits | 239,616 | — |
| Number of CLBs / LABs | 1,206 LABs (each with 10 LEs) | — |
| Number of Logic Cells / Gates | 12,060 cells (Cyclone Family) | — |
| User I/Os | 249 | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Core Voltage | 1.5 V | — |
| Operating Frequency (max) | 320.1 MHz | — |
| Number of PLLs | 2 | — |
| Kemasan | 324-ball FineLine BGA (FBGA-324) | FBGA-324 |
| Package Dimensions | 19 x 19 mm, 1.0 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Suhu Operasi | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Configuration Mode | Passive Serial (PS) / Active Serial (AS) / JTAG | — |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 8 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |