EP1C12F324C8 vs EP1C12F324C7 Perbandingan
Perbandingan bersamaan detil EP1C12F324C8 dari Intel dan EP1C12F324C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C12F324C8 | EP1C12F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Paket | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | 2 |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | — |
| Suhu Kerja | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Operating Frequency (max) | — | 320.1 MHz |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |