EP1C12F324C8 vs EP1C12F324C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C12F324C8 disebabkan oleh Intel dan EP1C12F324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C12F324C8 | EP1C12F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Kemasan | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | 2 |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | — |
| Suhu Operasi | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Operating Frequency (max) | — | 320.1 MHz |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |