EP1M350F780C7 vs EP1M350F780I6AA Perbandingan
Perbandingan bersamaan detil EP1M350F780C7 dari Intel dan EP1M350F780I6AA dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1M350F780C7 | EP1M350F780I6AA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Mercury (PLD) | Mercury |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Logic Array Blocks (LABs) | 1440 | — |
| System Gates | 350,000 | — |
| Maximum User I/Os | 486 | — |
| Paket | 780-ball FineLine BGA (F780) | 780-Ball FC-FBGA |
| Package Type | FINE LINE BGA-780 | — |
| Supply Voltage (Core) | 1.8 V | — |
| Logic Family | CMOS | — |
| Suhu Kerja | 0 C to 85 C (Commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR | — |
| Configuration Method | JTAG / Quartus II | Serial / Parallel via EPC configuration device |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Process Technology | CMOS SRAM-based | 0.13 µm CMOS |
| Device Logic Elements / Cells | — | 14,400 |
| Number of Gates | — | 350K system gates |
| Tegangan Pemuat Kerja | — | 1.8 V core |
| User I/O Count | — | 486 |
| Speed Grade | — | 6 (slowest) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free Assembly | — | Yes (AA suffix) |
| Embedded Transceivers | — | Yes (high-speed differential with CDR support) |
| Supplier Device Package | — | 780-FBGA |