EP1SGX25DF1020I7 vs EP1SGX25F1020C6 Perbandingan
Perbandingan bersamaan detil EP1SGX25DF1020I7 dari Intel dan EP1SGX25F1020C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1SGX25DF1020I7 | EP1SGX25F1020C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Cells | 25,660 | — |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Maximum Operating Frequency | 4,385.97 MHz | — |
| Combinatorial CLB Delay | 9.48 ns | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| Paket | 1020-ball FC-FBGA | 1020-ball FineLine BGA (FBGA-1020) |
| Speed Grade | I7 (industrial) | — |
| Suhu Kerja | -40C to +100C (industrial) | 0C to 85C (commercial) |
| Jumlah Pin | 1020 | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Form of Terminal | Ball | — |
| Transceiver Support | Embedded multi-gigabit transceivers (Stratix GX family) | — |
| Logic Elements | — | 25,660 |
| LABs/CLBs | — | 2,566 |
| Total RAM Bits | — | 1,944,576 |
| User I/O Pins | — | 607 |
| Package Dimensions | — | 33 x 33 mm, 1.0 mm pitch |
| Core Voltage | — | 1.5 V |
| Logic Family | — | CMOS |
| Transceivers | — | Up to 20 multi-gigabit channels (this die density supports up to 14 active) |
| Transceiver Data Rate | — | 622 Mbps to 3.1875 Gbps |
| Tipe Mounting | — | Surface Mount (BGA) |
| Lead Free | — | Yes |
| Status RoHS | — | [DATA_NEEDED: rohs status] |
| Level MSL | — | [DATA_NEEDED: msl level] |