EP2A25F672C8N vs EP2A25F672C9 Perbandingan
Perbandingan bersamaan detil EP2A25F672C8N dari Intel dan EP2A25F672C9 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672C8N | EP2A25F672C9 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| User I/Os | 492 | — |
| Paket | 672-ball FC-FBGA (FineLine BGA) | 672-ball FCBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| Suhu Kerja | 0 C to 85 C (commercial) | 0°C to 85°C (Commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Logic Family | — | CMOS |
| Tegangan Pemuat | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |