EP2A25F672C8N vs EP2A25F672C9 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C8N disebabkan oleh Intel dan EP2A25F672C9 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C8N | EP2A25F672C9 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| User I/Os | 492 | — |
| Kemasan | 672-ball FC-FBGA (FineLine BGA) | 672-ball FCBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| Suhu Operasi | 0 C to 85 C (commercial) | 0°C to 85°C (Commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Logic Family | — | CMOS |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |