EP2A25F672I7N vs EP2A25F672I6 Perbandingan
Perbandingan bersamaan detil EP2A25F672I7N dari Intel dan EP2A25F672I6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672I7N | EP2A25F672I6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 24,320 | — |
| Typical Gate Count | 900,000 | — |
| Maximum Internal Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Supply Voltage | 1.5 V | — |
| Paket | 672-ball FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Pin/Ball Count | 672 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) | — |
| Speed Grade | 7 | 6 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Design Software | Quartus II | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Status Lingkungan Hidup | Not Recommended for New Designs (NRND) | — |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Core Voltage | — | 1.5 V |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| Embedded Memory | — | Embedded System Blocks (ESB), dual-port RAM / CAM |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |