EP2A25F672I7N vs EP2A25F672I6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I7N disebabkan oleh Intel dan EP2A25F672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672I7N | EP2A25F672I6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 24,320 | — |
| Typical Gate Count | 900,000 | — |
| Maximum Internal Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Supply Voltage | 1.5 V | — |
| Kemasan | 672-ball FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Pin/Ball Count | 672 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) | — |
| Speed Grade | 7 | 6 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Design Software | Quartus II | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Status Lingkungan Hidup | Not Recommended for New Designs (NRND) | — |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Core Voltage | — | 1.5 V |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| Embedded Memory | — | Embedded System Blocks (ESB), dual-port RAM / CAM |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |