EP2A25F672I7N vs EP2A25F672I6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I7N sa pamamagitan ng Intel at EP2A25F672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672I7N | EP2A25F672I6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 24,320 | — |
| Typical Gate Count | 900,000 | — |
| Maximum Internal Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Supply Voltage | 1.5 V | — |
| Packhaging | 672-ball FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Pin/Ball Count | 672 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) | — |
| Speed Grade | 7 | 6 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Design Software | Quartus II | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Katayuan ng Lifecycle | Not Recommended for New Designs (NRND) | — |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Core Voltage | — | 1.5 V |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| Embedded Memory | — | Embedded System Blocks (ESB), dual-port RAM / CAM |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |