EP2A70F1508C9 vs EP2A70F1508C8ES Perbandingan
Perbandingan bersamaan detil EP2A70F1508C9 dari Intel dan EP2A70F1508C8ES dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Waktu Beli TerakhirIntel
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
EP2A70F1508C8ES ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2A70F1508C9 | EP2A70F1508C8ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Series | APEX II | EP2A |
| Family | APEX II FPGA | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Paket / Case | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Suhu Kerja | 0 °C to 85 °C | Commercial (0C to +85C) |
| Speed Grade | C9 | -8 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Check manufacturer page - APEX II is a mature family with mixed compliance |
| Level MSL | [DATA_NEEDED: MSL level] | 3 |
| System Gates | — | 1,146,880 |
| Logic Elements | — | 67,200 |
| Embedded System Blocks (ESB) | — | Available (dual-port RAM/ROM/FIFO/CAM) |
| Maximum User I/O | — | 1,060 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage | — | 1.5 V |
| Paket | — | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Configuration Memory | — | SRAM (in-system programmable) |