EP2AGX125EF35C4G vs EP2AGX125EF35I3G Perbandingan
Perbandingan bersamaan detil EP2AGX125EF35C4G dari Intel dan EP2AGX125EF35I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
EP2AGX125EF35C4G ⚠ Waktu Beli TerakhirIntel
EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel
EP2AGX125EF35I3G ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2AGX125EF35C4G | EP2AGX125EF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Family | Arria II GX | — |
| Logic Elements | 118,143 | 118143 LE |
| Embedded Memory Bits | 8,315,904 | — |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 452 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| Core Voltage | 0.9 V | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Technology | 40 nm | — |
| Paket | 1152-ball FC-FBGA (Flip-Chip) | — |
| Suhu Kerja | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount | — |
| Configuration Method | SRAM-based, PS/FPP/JTAG | — |
| Status RoHS | Compliant | Compliant |
| Speed Grade | C4 | I3 |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Adaptive Logic Modules (ALMs) | — | 49640 ALM |
| Embedded Memory | — | 7.93 Mbit |
| Total RAM Bits | — | 8315904 bit |
| Number of I/O | — | 452 |
| Paket / Case | — | 1152-BBGA, FCBGA |
| Gaya Mounting | — | SMD/SMT |
| Process Node | — | 40 nm |
| Packaging | — | Tray |
| Lead Free | — | Yes |
| Transceivers | — | Up to 8 SERDES channels (per family) |