EP2AGZ300FF35I4 vs EP2AGZ350FF35I4 Perbandingan
Perbandingan bersamaan detil EP2AGZ300FF35I4 dari Intel dan EP2AGZ350FF35I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FF35I4 | EP2AGZ350FF35I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | 348,500 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Paket | 1152-ball FC-FBGA (FF35) | 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | Up to 16 channels, 6.375 Gbps |
| Embedded Memory | M20K blocks (distributed) | 21,270,528 bits (~21.27 Mbit) |
| DSP Blocks | Hard DSP columns (variable precision) | Variable-precision 18x18 multipliers |
| PCIe Support | PCIe Gen2 hard IP | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Adaptive Logic Modules (ALMs) | — | 139,400 |
| Logic Array Blocks (LABs) | — | 13,940 |
| User I/O Pins | — | 554 |
| Operating Temperature (TJ) | — | -40C to +100C (Industrial) |
| Lead Free | — | Yes |