EP2AGZ300FH29I4G vs EP2AGZ300FH29C3G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FH29I4G dari Intel dan EP2AGZ300FH29C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FH29I4G | EP2AGZ300FH29C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ (AGZ) | — |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | 281 |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Rentang Suhu Kerja | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | 3 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | [DATA_NEEDED: core voltage] |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | Yes (multi-gigabit) |
| DSP Blocks | Yes (variable-precision, per family) | Yes (variable-precision DSP) |
| Block RAM | Embedded M9K / M144K blocks | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, where stated) |
| Lead-Free | Yes (per RoHS) | — |
| Series | — | Arria II GZ |
| Manufacturer | — | Intel (Altera) |
| Logic Elements | — | 300,000 |
| Paket | — | 780-BGA (HBGA, 29 mm) |
| Suhu Kerja | — | 0C to +85C (commercial, speed grade 3) |
| Embedded Memory | — | M9K / M144K block RAM |