EP2AGZ300FH29I4G vs EP2AGZ300FH29C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FH29I4G disebabkan oleh Intel dan EP2AGZ300FH29C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FH29I4G | EP2AGZ300FH29C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ (AGZ) | — |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | 281 |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Gambaran Suhu Operasi | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | 3 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | [DATA_NEEDED: core voltage] |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | Yes (multi-gigabit) |
| DSP Blocks | Yes (variable-precision, per family) | Yes (variable-precision DSP) |
| Block RAM | Embedded M9K / M144K blocks | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, where stated) |
| Lead-Free | Yes (per RoHS) | — |
| Series | — | Arria II GZ |
| Manufacturer | — | Intel (Altera) |
| Logic Elements | — | 300,000 |
| Kemasan | — | 780-BGA (HBGA, 29 mm) |
| Suhu Operasi | — | 0C to +85C (commercial, speed grade 3) |
| Embedded Memory | — | M9K / M144K block RAM |