EP2AGZ350HF40C3N vs EP2AGZ350HF40I3 Perbandingan
Perbandingan bersamaan detil EP2AGZ350HF40C3N dari Intel dan EP2AGZ350HF40I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ350HF40C3N | EP2AGZ350HF40I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 348,500 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 139,400 |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | 21,270,528 bits |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | 24 channels up to 6.375 Gbps |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm low-power | 40 nm TSMC |
| Paket | 1517-ball FCBGA (HF40) | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | — |
| Embedded Memory Blocks | — | 950 M20K blocks |
| User I/O Pins | — | 13,940 |
| Hard PCIe Controllers | — | 4 x Gen2 |
| Hard Memory Controllers | — | 8 DDR3 controllers up to 800 MHz |
| PLLs | — | 16 (8 fPLL + 8 GPLL) |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| Status RoHS | — | Compliant |