EP2AGZ350HF40C3N vs EP2AGZ350HF40I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40C3N disebabkan oleh Intel dan EP2AGZ350HF40I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350HF40C3N | EP2AGZ350HF40I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 348,500 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 139,400 |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | 21,270,528 bits |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | 24 channels up to 6.375 Gbps |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm low-power | 40 nm TSMC |
| Kemasan | 1517-ball FCBGA (HF40) | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | — |
| Embedded Memory Blocks | — | 950 M20K blocks |
| User I/O Pins | — | 13,940 |
| Hard PCIe Controllers | — | 4 x Gen2 |
| Hard Memory Controllers | — | 8 DDR3 controllers up to 800 MHz |
| PLLs | — | 16 (8 fPLL + 8 GPLL) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| Status RoHS | — | Compliant |