EP2AGZ350HF40I3 vs EP2AGZ225HF40I3N Perbandingan
Perbandingan bersamaan detil EP2AGZ350HF40I3 dari Intel dan EP2AGZ225HF40I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ350HF40I3 | EP2AGZ225HF40I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | 139,400 | — |
| Embedded Memory Bits | 21,270,528 bits | — |
| Embedded Memory Blocks | 950 M20K blocks | — |
| DSP Blocks | 768 (18x18 multipliers) | — |
| User I/O Pins | 13,940 | — |
| Transceivers | 24 channels up to 6.375 Gbps | — |
| Hard PCIe Controllers | 4 x Gen2 | — |
| Hard Memory Controllers | 8 DDR3 controllers up to 800 MHz | — |
| PLLs | 16 (8 fPLL + 8 GPLL) | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Core Voltage | 0.9 V | — |
| Paket | 1517-BBGA, FCBGA (HF40) 40 x 40 mm | — |
| Suhu Kerja | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-256 | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/O | — | 734 |
| Logic Array Blocks (LABs) | — | 8,960 |
| Embedded Multipliers (18x18) | — | 736 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Speed Grade | — | I3 (industrial, -3) |
| Package Type | — | 1517-BBGA, FCBGA (flip-chip BGA) |
| Tipe Mounting | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | — | PCIe Gen1/Gen2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |