EP2C5F256I8 vs EP2C8F256I8N Perbandingan
Perbandingan bersamaan detil EP2C5F256I8 dari Intel dan EP2C8F256I8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C5F256I8 | EP2C8F256I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone II | — |
| Logic Elements (LE) | 4,608 | — |
| Configurable Logic Blocks (CLB) | 288 | — |
| Total RAM Bits | 119,808 | 165,888 |
| Embedded Memory (M4K blocks) | 250 kbit | — |
| Maximum User I/O | 158 | — |
| Paket | 256-ball FBGA (FineLine BGA) | — |
| Process Technology | 90 nm CMOS, 1.2 V core | 90 nm CMOS (SRAM-based) |
| Supply Voltage - Core (VCCINT) | 1.2 V | — |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Speed Grade | I8 (industrial, 8 ns pin-to-pin) | — |
| Suhu Kerja | -40 °C to +100 °C (industrial) | -40C to +85C (industrial) |
| PLL Count | Up to 4 | — |
| Embedded Multipliers (18×18) | Yes (DSP blocks) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | 3 | — |
| Status RoHS | Compliant | Compliant (Pb-free, lead-free reflow compatible) |
| Series | — | Cyclone II |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Embedded 18x18 Multipliers | — | Up to 36 |
| PLLs | — | 2 |
| Global Clock Networks | — | 16 |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |