EP2C5F256I8 vs EP2C8F256I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C5F256I8 disebabkan oleh Intel dan EP2C8F256I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C5F256I8 | EP2C8F256I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone II | — |
| Logic Elements (LE) | 4,608 | — |
| Configurable Logic Blocks (CLB) | 288 | — |
| Total RAM Bits | 119,808 | 165,888 |
| Embedded Memory (M4K blocks) | 250 kbit | — |
| Maximum User I/O | 158 | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | — |
| Process Technology | 90 nm CMOS, 1.2 V core | 90 nm CMOS (SRAM-based) |
| Supply Voltage - Core (VCCINT) | 1.2 V | — |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Speed Grade | I8 (industrial, 8 ns pin-to-pin) | — |
| Suhu Operasi | -40 °C to +100 °C (industrial) | -40C to +85C (industrial) |
| PLL Count | Up to 4 | — |
| Embedded Multipliers (18×18) | Yes (DSP blocks) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 | — |
| Status RoHS | Compliant | Compliant (Pb-free, lead-free reflow compatible) |
| Series | — | Cyclone II |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Embedded 18x18 Multipliers | — | Up to 36 |
| PLLs | — | 2 |
| Global Clock Networks | — | 16 |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |