EP2SGX130GF40C4NES vs EP2SGX130GF40C3NES Perbandingan

Perbandingan bersamaan detil EP2SGX130GF40C4NES dari Intel dan EP2SGX130GF40C3NES dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX130GF40C4NES EP2SGX130GF40C3NES
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Family Stratix II GX Stratix II GX
Logic Elements 132,540 132540
Logic Blocks / ALMs Approximately 53,000 ALMs —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage 1.2 V 1.2 V
Maximum Transceiver Data Rate 6.375 Gbps 6.375 Gbps
Transceiver Channels Up to 20 (4 to 20, device-dependent) 4 to 20 (per device family configuration)
User I/O Pins 734 —
Total Package Pins 1508 (FC-FBGA ball grid) —
Package Code GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) —
Speed Grade C4 (speed grade -4) —
Internal Operating Frequency Up to 717 MHz —
Embedded Memory Approximately 4.5 Mbits (TriMatrix) —
PLL Blocks 8 —
DSP Blocks Yes (variable, see datasheet) —
Tipe Mounting Surface Mount (flip-chip BGA) Surface Mount
Lead-Free / RoHS Yes (LEAD FREE per datasheet family code) —
Level MSL Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level] —
Suhu Kerja Commercial Extended (per N suffix) —
JEDEC Standard Reference MS-034AAU-1 —
Logic Array Blocks (LABs) — 7047
Maximum Internal Frequency — 778.82 MHz
Transceiver Feature — Embedded SERDES with Clock/Data Recovery (CRU)
Tipe Memori — TriMatrix embedded memory (distributed RAM, block RAM, shift register)
Paket — 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch)
Operating Temperature Grade — Commercial Extended
Terminal Form — Ball (BGA)
Status RoHS — Lead-free compliant (per package code MS-034AAU-1)
Series — EP2SGX130

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