EP2SGX60DF780C3 vs EP2SGX60CF780C7 Perbandingan
Perbandingan bersamaan detil EP2SGX60DF780C3 dari Intel dan EP2SGX60CF780C7 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60DF780C3 | EP2SGX60CF780C7 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Internal Frequency (max) | ~717 MHz | — |
| Paket | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FCBGA |
| Tipe Mounting | Surface Mount | — |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | C7 |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 2,544,192 bits |
| DSP Blocks | — | 24 (18x18 multipliers) |
| Maximum User I/O | — | 364 |
| Transceiver Channels | — | 12 |
| Process Node | — | 90 nm |
| Ball Pitch | — | 1.0 mm |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Configuration Scheme | — | Enhanced Configuration (EPC) |