EP2SGX60DF780C3 vs EP2SGX60CF780C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3 disebabkan oleh Intel dan EP2SGX60CF780C7 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60DF780C3 | EP2SGX60CF780C7 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Internal Frequency (max) | ~717 MHz | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FCBGA |
| Jenis Pemasangan | Surface Mount | — |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | C7 |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 2,544,192 bits |
| DSP Blocks | — | 24 (18x18 multipliers) |
| Maximum User I/O | — | 364 |
| Transceiver Channels | — | 12 |
| Process Node | — | 90 nm |
| Ball Pitch | — | 1.0 mm |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Scheme | — | Enhanced Configuration (EPC) |