EP2SGX90EF1152I3 vs EP2SGX90EF1152I3N Perbandingan
Perbandingan bersamaan detil EP2SGX90EF1152I3 dari Intel dan EP2SGX90EF1152I3N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Waktu Beli TerakhirAltera
EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
EP2SGX90EF1152I3N NrndPerbandingan Spesifikasi
| Parameter Umum | EP2SGX90EF1152I3 | EP2SGX90EF1152I3N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 (4.5 Mbits) |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | Ball |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | BGA |
| Package Shape | Square | Square |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix II GX |
| Logic Elements (LEs) | — | 90,960 |
| Equivalent LEs / CLBs | — | 90,960 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 816.9 MHz |
| Paket | — | 1152-ball FC-FBGA |
| Number of Terminals | — | 1152 |
| Transceivers | — | Multi-gigabit serial transceivers (GX family) |