EP3C10E144I7N vs EP3C10F256C6 Perbandingan
Perbandingan bersamaan detil EP3C10E144I7N dari Intel dan EP3C10F256C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C10E144I7N | EP3C10F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone® III | — |
| Family | Cyclone III (EP3C) | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Memory Blocks | 46 M9K blocks | — |
| Embedded Multipliers (18x18) | 23 | — |
| PLLs | 2 | 2 |
| User I/O Pins | 94 | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Process Technology | 65 nm CMOS | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | 1.2 V to 3.3 V (bank-dependent) |
| Paket | 144-LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40°C to +100°C (industrial, 'I7' grade) | -40 C to +125 C (industrial, suffix 'C') |
| Status RoHS | Compliant (lead-free, 'N' suffix) | Compliant (lead-free FBGA) |
| Embedded 18x18 Multipliers | — | 23 |
| Maximum User I/Os | — | 182 |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Speed Grade | — | 6 |
| Level MSL | — | 3 (168 hours) |