EP3C25F324C8 vs EP3C25F324I7N Perbandingan
Perbandingan bersamaan detil EP3C25F324C8 dari Intel dan EP3C25F324I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C8 | EP3C25F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | — |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded Multipliers | 66 (18 x 18) | — |
| User I/Os | 215 | — |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 8 (commercial) | 7 (slower speed grade, lower power) |
| Suhu Kerja | 0 °C to +85 °C (commercial) | -40C to +100C (Industrial) |
| Paket | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Maximum Internal Clock | 402 MHz | — |
| Status RoHS | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| Global Clock Networks | — | 20 |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Level MSL | — | 3 (168 hours) |