EP3C25F324C8 vs EP3C25F324I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C8 sa pamamagitan ng Intel at EP3C25F324I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C8 | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | — |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded Multipliers | 66 (18 x 18) | — |
| User I/Os | 215 | — |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 8 (commercial) | 7 (slower speed grade, lower power) |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | -40C to +100C (Industrial) |
| Packhaging | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Maximum Internal Clock | 402 MHz | — |
| Tindminan RoHS | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| Global Clock Networks | — | 20 |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 (168 hours) |