EP3C25F324C8N vs EP3C25F324C7N Perbandingan
Perbandingan bersamaan detil EP3C25F324C8N dari Intel dan EP3C25F324C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C8N | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Paket | 324-BGA (FineLine) | 324-ball FBGA |
| Supply Voltage - Core | 1.2 V | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Embedded Memory | — | 608,256 bits |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |