EP3C40F780C6N vs EP3C40F780C8 Perbandingan
Perbandingan bersamaan detil EP3C40F780C6N dari Intel dan EP3C40F780C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780C6N | EP3C40F780C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | 39,600 |
| Embedded Memory Bits | 1,161,216 | — |
| Embedded Memory (Kbytes) | 113 | — |
| M9K Memory Blocks | 126 | — |
| Logic Array Blocks (LABs) | 4,065 | — |
| Maximum User I/O Pins | 535 | 535 |
| PLLs | 4 | — |
| Process Technology | 60 nm CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Paket | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Package Height | 2.6 mm | — |
| Tipe Mounting | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Configuration Method | SRAM, JTAG via USB-Blaster | — |
| Status RoHS | Compliant | Compliant |
| Series | — | EP3C40 |
| Total Memory Bits | — | 1,161,216 bits (1134 Kbit) |
| Embedded Memory | — | M9K blocks, 486 Kbit total (per family datasheet) |
| Embedded 18x18 Multipliers | — | 126 |
| General Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | — | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Configuration | — | Serial (AS) / Parallel (AP) / JTAG |