EP3C55F484I7 vs EP3C55F484C6N Perbandingan
Perbandingan bersamaan detil EP3C55F484I7 dari Intel dan EP3C55F484C6N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484I7 | EP3C55F484C6N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| Suhu Kerja | -40 °C to +100 °C (Industrial grade, I-suffix) | — |
| Paket | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Lead-Free, RoHS Compliant | — |
| Level MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm |
| Number of Logic Elements | — | 55856 |
| Number of User I/O | — | 327 |
| Total RAM Bits | — | 2396160 |
| Core Supply Voltage | — | 1.2 V |
| Paket / Case | — | FBGA-484, 23 x 23 mm |
| Ball Count | — | 484 |
| Ball Pitch | — | 1 mm |
| Package Height | — | 2.60 mm |
| Speed Grade | — | 6 (C6) |
| Rentang Suhu Kerja | — | 0°C to +85°C |
| Maximum Internal Frequency | — | 472 MHz |
| Lead-Free / RoHS | — | Lead-free (N suffix) |