EP3CLS70F780I7 vs EP3CLS70F780C8N Perbandingan

Perbandingan bersamaan detil EP3CLS70F780I7 dari Intel dan EP3CLS70F780C8N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3CLS70F780I7 EP3CLS70F780C8N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 70,208 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory Bits 3,068,928 bits (2.93 Mbit) —
Embedded Memory Blocks (M9K) [DATA_NEEDED: M9K count] —
Hardware Multipliers (18x18) 413 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/Os 429 —
Paket 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) —
Operating Temperature (Industrial, 'I') -40C to +100C (case) —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Configuration Support JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) —
Bitstream Encryption AES-128/256 (LS-family feature) —
Process Node 60 nm TSMC low-power —
Status RoHS Non-compliant (per Cyclone III LS datasheet prefix per verified data) [DATA_NEEDED: RoHS status]
Speed Grade 7 (moderate) —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells / Logic Blocks — 47
Logic Cell Count — 70,208 cells
User I/O — 413 I/O
Tegangan Pemuat — 1.2 V
Maximum Operating Frequency — 402 MHz
Process Technology — 65 nm
Package Type — FBGA
Package Pin Count — 780 balls
Package Form — BGA, square
Tipe Mounting — Surface Mount
Temperature Grading — Other
Configuration Type — SRAM-based FPGA
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Spek dan Sumber

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