EP3CLS70F780I7 vs EP3CLS70F780C8N 比較

詳細並排比較 EP3CLS70F780I7 由 Intel 與 EP3CLS70F780C8N 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS70F780I7 EP3CLS70F780C8N
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 70,208 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory Bits 3,068,928 bits (2.93 Mbit) —
Embedded Memory Blocks (M9K) [DATA_NEEDED: M9K count] —
Hardware Multipliers (18x18) 413 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/Os 429 —
封裝 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) —
Operating Temperature (Industrial, 'I') -40C to +100C (case) —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Configuration Support JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) —
Bitstream Encryption AES-128/256 (LS-family feature) —
Process Node 60 nm TSMC low-power —
RoHS 狀態 Non-compliant (per Cyclone III LS datasheet prefix per verified data) [DATA_NEEDED: RoHS status]
Speed Grade 7 (moderate) —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells / Logic Blocks — 47
Logic Cell Count — 70,208 cells
User I/O — 413 I/O
供應電壓 — 1.2 V
Maximum Operating Frequency — 402 MHz
Process Technology — 65 nm
Package Type — FBGA
Package Pin Count — 780 balls
Package Form — BGA, square
安裝類型 — Surface Mount
Temperature Grading — Other
Configuration Type — SRAM-based FPGA
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

資料表與資源

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