EP3SE110F1152I4 vs EP3SE110F1152I4L Perbandingan

Perbandingan bersamaan detil EP3SE110F1152I4 dari Intel dan EP3SE110F1152I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE110F1152I4 EP3SE110F1152I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family Stratix III E —
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4300 —
DSP Blocks 744 —
Embedded Memory (bits) 8,936,448 —
User I/Os 744 —
Paket 1152-ball FCBGA (Flip-Chip BGA) 1152-BBGA, FCBGA
Suhu Kerja -40°C to +100°C (Industrial) -40C to +100C (Industrial)
Process Node 40 nm —
Maximum User I/O Speed [DATA_NEEDED: maximum I/O toggle rate MHz] —
PLLs 24 —
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) —
Memory Interface Support DDR3, DDR2, QDRII+, RLDRAM II —
Transceiver Protocol Support PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO —
Status RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes —
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating] 3 (168 Hours)
Series — Stratix III E
Logic Elements — 107,500
Embedded Memory Bits — 8,936,448 bits
User I/O Count — 744
Number of LABs/CLBs — 4300
DSP Multipliers — 528 (9-bit equivalent)
Speed Grade — I4 (fastest industrial grade)
Process Technology — 40 nm
Supply Voltage (Core) — [DATA_NEEDED: nominal core voltage]
Packaging — Tray

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