EP3SE110F780C3N vs EP3SE80F780C2N Perbandingan
Perbandingan bersamaan detil EP3SE110F780C3N dari Intel dan EP3SE80F780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F780C3N | EP3SE80F780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | 3,200 |
| User I/Os | 488 | 488 |
| Paket | 780-ball FCBGA (Flip-Chip BGA) | 780-Ball FC-FBGA |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 500 MHz | 600 MHz |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 6,843,392 bits |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | Commercial (0C to +85C) |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements (LE) | — | 80,000 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Auxiliary Voltage (VCCAUX) | — | 0.9 V |
| Package Code | — | F780 |
| Speed Grade | — | C2 |