EP3SE110F780C3N vs EP3SE80F780C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C3N disebabkan oleh Intel dan EP3SE80F780C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C3N | EP3SE80F780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | 3,200 |
| User I/Os | 488 | 488 |
| Kemasan | 780-ball FCBGA (Flip-Chip BGA) | 780-Ball FC-FBGA |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 500 MHz | 600 MHz |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 6,843,392 bits |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | Commercial (0C to +85C) |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements (LE) | — | 80,000 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Auxiliary Voltage (VCCAUX) | — | 0.9 V |
| Package Code | — | F780 |
| Speed Grade | — | C2 |