EP3SE110F780C4 vs EP3SE110F780I4L Perbandingan
Perbandingan bersamaan detil EP3SE110F780C4 dari Intel dan EP3SE110F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F780C4 | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | 8,936,448 bits (8.9 Mbit) |
| DSP Blocks (18x18 Multipliers) | 896 | — |
| Maximum User I/O | 488 | — |
| Paket | 780-ball FCBGA (FineLine BGA) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C4 | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 1.6 Gbps | — |
| Memory Interface Support | DDR3 up to 800 MHz | — |
| Suhu Kerja | Commercial (0C to +85C) | — |
| Tipe Mounting | Surface Mount | Surface Mount (FC-FBGA) |
| Status RoHS | Compliant | Compliant (per legacy Altera data) |
| Configuration | Partial Reconfiguration support | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |