EP3SE110F780C4 vs EP3SE110F780I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C4 disebabkan oleh Intel dan EP3SE110F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C4 | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | 8,936,448 bits (8.9 Mbit) |
| DSP Blocks (18x18 Multipliers) | 896 | — |
| Maximum User I/O | 488 | — |
| Kemasan | 780-ball FCBGA (FineLine BGA) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C4 | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 1.6 Gbps | — |
| Memory Interface Support | DDR3 up to 800 MHz | — |
| Suhu Operasi | Commercial (0C to +85C) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (FC-FBGA) |
| Status RoHS | Compliant | Compliant (per legacy Altera data) |
| Configuration | Partial Reconfiguration support | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |