EP3SE110F780C4N vs EP3SE110F780I4L Perbandingan
Perbandingan bersamaan detil EP3SE110F780C4N dari Intel dan EP3SE110F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F780C4N | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | — |
| Embedded Memory Bits | 8936448 | — |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | — |
| Suhu Kerja | 0C to 85C (Commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount (FC-FBGA) |
| Status RoHS | Compliant | Compliant (per legacy Altera data) |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Elements | — | 107,500 |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Paket | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |