EP3SE110F780C4N vs EP3SE110F780I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C4N disebabkan oleh Intel dan EP3SE110F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C4N | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | — |
| Embedded Memory Bits | 8936448 | — |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | — |
| Suhu Operasi | 0C to 85C (Commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (FC-FBGA) |
| Status RoHS | Compliant | Compliant (per legacy Altera data) |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Elements | — | 107,500 |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Kemasan | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |