EP3SE260F1152C4N vs EP3SE260F1152I3N Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C4N EP3SE260F1152I3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Waktu Pembelian Terakhir
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) —
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 1.1 V 0.9 V to 1.1 V selectable
Maximum Operating Frequency 450 MHz —
Paket 1152-ball FC-FBGA (flip-chip) —
Speed Grade -4 (commercial temperature) —
Suhu Kerja 0C to +85C (commercial, 'C' suffix) -40C to +100C (industrial)
Tipe Mounting Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Tipe Memori SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Family Name — Stratix III E
Logic Elements / Cells — 255000
Logic Array Blocks (LABs) — 10200
Total RAM Bits — 16672768
Number of I/Os — 744
Number of Gates — [DATA_NEEDED: number of gates]
Paket / Case — 1152-BBGA, FCBGA (FC-FBGA)
Max Internal Frequency — 500 MHz
Supplier Temperature Grade — Industrial
Status RoHS — [DATA_NEEDED: RoHS status]
Level MSL — [DATA_NEEDED: MSL level]

Spek dan Sumber

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