EP3SE260F1517C2G vs EP3SE260F1152C2 Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C2G dari Intel dan EP3SE260F1152C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C2G | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Paket | 1517-ball FCBGA, 40x40 mm | 1152-ball FC-FBGA (Flip Chip) |
| Speed Grade | C2 (commercial, ~6 ns) | C2 (commercial) |
| Suhu Kerja | 0C to 85C (commercial, "C" suffix) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Process Node | 40 nm TSMC | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Tipe Mounting | — | Surface Mount |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |