EP3SE260F1517C2G vs EP3SE260F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C2G disebabkan oleh Intel dan EP3SE260F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517C2G | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Kemasan | 1517-ball FCBGA, 40x40 mm | 1152-ball FC-FBGA (Flip Chip) |
| Speed Grade | C2 (commercial, ~6 ns) | C2 (commercial) |
| Suhu Operasi | 0C to 85C (commercial, "C" suffix) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Process Node | 40 nm TSMC | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Jenis Pemasangan | — | Surface Mount |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |