EP3SE260F1517C2G vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2G sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2G | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Packhaging | 1517-ball FCBGA, 40x40 mm | 1152-ball FC-FBGA (Flip Chip) |
| Speed Grade | C2 (commercial, ~6 ns) | C2 (commercial) |
| Temperature na Operasyon | 0C to 85C (commercial, "C" suffix) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Process Node | 40 nm TSMC | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Uri ng Pagpapasok | — | Surface Mount |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |