EP3SE50F484C2G vs EP3SE50F484C3G Perbandingan
Perbandingan bersamaan detil EP3SE50F484C2G dari Intel dan EP3SE50F484C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
EP3SE50F484C2G ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE50F484C2G | EP3SE50F484C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Series | Stratix III E | — |
| Number of Logic Elements / Cells | 47,500 | — |
| Number of LABs / CLBs | 1,900 | — |
| Total RAM Bits | 5,760,000 (5,760 Kbit) | — |
| Number of User I/O | 296 | — |
| Paket / Case | 484-BBGA, FCBGA (FineLine BGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Core Voltage Supply | 0.86 V to 1.15 V | — |
| Suhu Kerja | 0 °C to +85 °C (TJ) | 0C to +85C (commercial, "C") |
| Process Technology | 40 nm TSMC low-power CMOS | — |
| Logic Element Architecture | Adaptive Logic Module (ALM) with 8-input fracturable LUT | — |
| Embedded DSP Blocks | Yes (variable-precision multipliers) | — |
| Transceivers | Multi-gigabit transceivers (selected package pins) | — |
| Memory Interface Support | DDR / DDR2 / DDR3 with hard PHY | — |
| Partial Reconfiguration | Supported | — |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel | — |
| Part Status | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Family | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Total Embedded Memory | — | 5,760,000 bits (5.76 Mbit) |
| M9K Memory Blocks | — | 320 (2,304 Kbits) |
| M144K Memory Blocks | — | 12 (1,728 Kbits) |
| User I/O Pins | — | 296 |
| 18x18 Multipliers | — | 384 |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Paket | — | 484-ball FCBGA (F484), 1.0 mm pitch |
| Speed Grade | — | C3 |
| Process Node | — | 65 nm TSMC low-power |
| Core Voltage | — | 1.1 V |