EP3SE50F484C3G vs EP3SE50F484C2N Perbandingan
Perbandingan bersamaan detil EP3SE50F484C3G dari Intel dan EP3SE50F484C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F484C3G | EP3SE50F484C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E FPGA |
| Logic Elements | 47,500 | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Paket | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | — |
| Suhu Kerja | 0C to +85C (commercial, "C") | 0C to +85C (Commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| User I/Os | — | 296 |
| LABs/CLBs | — | 1,900 |
| Internal Frequency | — | 600 MHz |
| Process Technology | — | 65 nm |
| Lead-Free | — | Yes |