EP3SE50F484C3G vs EP3SE50F484C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C3G disebabkan oleh Intel dan EP3SE50F484C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484C3G | EP3SE50F484C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E FPGA |
| Logic Elements | 47,500 | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Kemasan | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | — |
| Suhu Operasi | 0C to +85C (commercial, "C") | 0C to +85C (Commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| User I/Os | — | 296 |
| LABs/CLBs | — | 1,900 |
| Internal Frequency | — | 600 MHz |
| Process Technology | — | 65 nm |
| Lead-Free | — | Yes |