EP3SE50F484C4LN vs EP3SE50F484I3N Perbandingan
Perbandingan bersamaan detil EP3SE50F484C4LN dari Intel dan EP3SE50F484I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F484C4LN | EP3SE50F484I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| LABs/CLBs | 1900 | — |
| Total RAM Bits | 2,344,448 (2286 Kbit) | — |
| Number of I/O | 296 | — |
| Number of Multipliers (18x18) | 384 | — |
| Voltage - Supply (Core) | 0.85 V to 1.1 V | — |
| Voltage - Supply (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Paket / Case | 484-BBGA, FCBGA (FineLine BGA) | — |
| Lead Free / RoHS | Lead free / RoHS compliant | — |
| Process Node | 40 nm CMOS | — |
| Speed Grade | C4 | I3 (industrial, bin 3) |
| Configuration | FPP / AS / JTAG | — |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Maximum User I/O | — | 296 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Internal Frequency | — | 500 MHz |
| Paket | — | 484-pin FC-FBGA (flip-chip BGA) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |